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Resin Bond Diamond Grinding Wheel 4A2 150*14*20*5*2mm D64 C100 for Sharpening of carbide tools

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Resin Bond Diamond Grinding Wheel  4A2 150*14*20*5*2mm D64 C100 for Sharpening of carbide tools
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제품 사양
모양: 디스크 유형
용법: 연마
회사채 대리인: 수지
배달: Express에 의해
패키지: 상자 상자
HS 코드: 6804211000
연마재: 다이아몬드
애플리케이션: 초경합금
지름: 150mm
두께: 14mm
내부 구멍: 20mm
연마 폭: 5mm
세분성: D64
연마 깊이: 2mm
기본 자료: 알류미늄
강조하다:

resin bond diamond grinding wheel for carbide tools

,

4A2 diamond grinding wheel D64 C100

,

150mm resin bond grinding wheel with warranty

기본 정보
원래 장소: 중국 허난
브랜드 이름: JC
인증: ISO
모델 번호: 4A2
결제 및 배송 조건
포장 세부 사항: 한 용지함에서 1 PC
배달 시간: 5-8 일
지불 조건: T/T, D/A, D/P, 웨스턴 유니온, 페이팔
공급 능력: 월 10,000 개
제품 설명

4A2 Resin Bond Doamond Grinding Wheel Product Description


Product Name: Resin Bond Diamond Grinding Wheel


Product Overview:

 

Resin diamond grinding wheel is a high-performance grinding tool with resin as the binder and diamond abrasive as the cutting body. It combines the ultra-high hardness of diamond and the flexibility of resin binder, and is suitable for high-precision and high-efficiency processing of hard and brittle materials such as ceramics, glass, semiconductors, and cemented carbide.

 

Product Features:

 

High grinding efficiency: Diamond has an extremely high hardness (Mohs hardness 10), which can quickly remove hard and brittle materials.

Good self-sharpening: Resin binders wear moderately, which can continuously expose new abrasive grains and maintain sharpness.

Low grinding temperature: Resin has poor thermal conductivity, but thermal damage can be reduced through pores or coolant.

High surface quality: Suitable for precision machining, reducing chipping or cracks on the workpiece.

Lightweight design: Resin has low density and is suitable for high-speed grinding.

 

Product size(mm):

 

Diameter(D) Thickness(T) Inner hole(H) Abrasive width(W) Abrasive depth(X) Granularity
150 15 20 5 2 D64

 

Of course if you need other sizes , we can  customize for you.

 

Application:

 

Cemented carbide: sharpening and polishing of cutting tools and molds.

Ceramics/glass: precision processing of mobile phone covers and optical lenses.

Semiconductor materials: cutting and grinding of silicon wafers and silicon carbide wafers.

Stone processing: shaping and polishing of marble and granite.

 

Packaging and Shipping:

 

Each CBN grinding wheel is carefully packed in a sealed bag and wrapped with bubble film to prevent scratches or damage during transportation. After packaging, it is placed in a carton and sealed securely with tape. All orders are shipped via reliable couriers. After the order is shipped, we will provide customers with tracking information and estimated delivery time.

 

Competitive Advantages:

 

1.We offer high quality products at competitive price.
2. Shortest delivery time.
3. Flexible payment terms.
4. Timely after-sale service.
5. Most of our equipment can be replaceable with international brands.
6. Our products have been exported to Argentina, Egypt, US, Australia, Romania, Pakistan, Dubai, Abu Dhabi, Iran, India,
Indonesia, Vietnam, Malaysia and many other countries.

 

Resin Bond Diamond Grinding Wheel  4A2 150*14*20*5*2mm D64 C100 for Sharpening of carbide tools 0

 

 

Looking forward to your inquiry!

추천된 제품
우리와 연락하기
담당자 : Mr. XU
전화 번호 : 86-13783415132
팩스 : 86-371-86588970
남은 문자(20/3000)