간략히: Discover the 12V9 150*20*31.75*10mm D30 C125 Resin Bond Diamond Grinding Wheel, designed for precision grinding of carbide tools, ceramic components, and semiconductor materials. This high-quality grinding wheel features diamond abrasives for ultra-hardness and wear resistance, with a resin binder for elasticity and heat dissipation. Perfect for tool grinders and cylindrical grinders.
관련 제품 기능:
12V9 cup wheel shape for precision grinding applications.
150mm outer diameter (D) and 20mm thickness (T) for versatile use.
31.75mm inner hole diameter (H) ensures compatibility with standard machines.
10mm abrasive width (W) for precise material removal.
D30 다이아몬드 연마 입자(G)는 초고 경도와 내마모성을 제공합니다.
C125 diamond concentration (C) for optimal performance.
Resin binder (phenolic, polyimide, or epoxy) offers elasticity and heat dissipation.
특정 요구 사항을 충족하도록 맞춤형 크기를 사용할 수 있습니다.
자주 묻는 질문:
12V9 레진 결합 다이아몬드 밀링 휠은 어떤 재료를 처리 할 수 있습니까?
이 연삭 휠은 초경 공구, 세라믹 부품 및 반도체 재료 가공에 이상적입니다.
What machine tools are compatible with this grinding wheel?
It is suitable for use with tool grinders and cylindrical grinders.
Can the grinding wheel be customized to different sizes?
Yes, we offer customization for other sizes based on your specific requirements.